Transcript
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Overview
KEMET’s Z5U dielectric features an 85°C maximum operating temperature and is considered “general-purpose.” The Electronics Components, Assemblies & Materials Association (EIA) characterizes Z5U dielectric as a Class III material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling or other applications in which dielectric losses, high insulation resistance and capacitance stability are not of major importance. Z5U exhibits a predictable change in capacitance with respect to time and voltage and displays wide variations in capacitance with reference to ambient temperature. Capacitance change is limited to +22%, -56% from +10°C to +85°C.
Benefits
• • • • • • • •
+10°C to +85°C operating temperature range Pb-Free and RoHS compliant EIA 0805, 1206, 1210, 1812, 1825, and 2225 case sizes DC voltage ratings of 50V and 100V Capacitance offerings ranging from 6,800pF to 2.2μF Available capacitance tolerances of ±20% and +80%-20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated end metallization allowing for excellent solderability
Applications
Typical applications include limited temperature, decoupling and bypass.
Ordering Information
C
Ceramic
1825
Case Size (L" x W") 0805 1206 1210 1812 1825 2225
C
Specification/ Series C = Standard
225
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
M
Capacitance Tolerance M = ±20% Z = +80%/ -20
5
Voltage 5 = 50V 1 = 100V
U
Dielectric U = Z5U
A
Failure Rate/ Design A = N/A
C
End Metallization (Plated)1 C = 100% Matte Sn
TU
Packaging/Grade (C-Spec)2 Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked
1 2
Additional termination options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details.
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C1004-1 • 10/12/2010 1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
T
W
L B
100% Tin or SnPb Plate
S
Nickel Plate Electrodes Conductive Metalization
EIA Size Metric Size Code Code
0805 1206 1210 1812 1825 2225 2012 3216 3225 4532 4564 5664
L Length
2.00 (.079) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 4.50 (.177) ± 0.30 (.012) 4.50 (.177) ± 0.30 (.012) 5.60 (.220) ± 0.40 (.016)
W Width
1.25 (.049) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 3.20 (.126) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
B Bandwidth
0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.60 (.024) ± 0.35 (.014) 0.60 (.024) ± 0.35 (.014) 0.60 (.024) ± 0.35 (.014)
T Thickness Mounting Technique
Solder Wave or Solder Reflow See Table 2 for Thickness
Solder Reflow Only
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability.
Environmental Compliance
RoHS PRC ( Peoples Republic of China) compliant
Electrical Parameters/Characteristics
Item
Operating Temperature Range: Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25ºC: Insulation Resistance (IR) Limit @ 25°C: -10°C to +85°C +22%, -56% 7.0% 250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding 50mA) 4.0% 100 megohm microfarads or 10GΩ
Parameters/Characteristics
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Table 1 – (0805 - 2225 Case Sizes)
Cap
6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF 0.27 uF 0.33 uF 0.39 uF 0.47 uF 0.56 uF 0.68 uF 0.82 uF 1.0 uF 1.2 uF 1.5 uF 1.8 uF 2.2 uF
Cap Code
682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225
Series
Voltage Code Voltage DC Cap Tolerance M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z 5
C0805
1 100 5 50
C1206
1 100 5 50
C1210
1 100 5 50
C1812
1 100 5 50
C1825
1 100 5 50 50
C2225
1 100 KC KC KC
Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions
DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EB EB EB EB EC EC EB EB EB EB
FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH
FB FB FB FC FD FD FD
GB GB GB GB GB GB GB GB GB GB GC GC GE GE
GB GB GB GB
HB HB HB HB HB HB HB HB HB HB HB HC HD HF 50 5
HB HB HB HB HB
KB KB KB KB KB KB KB KB KC KD KD 50 5
100
100
100
100
100
Cap
Cap Code
Voltage Code
5
1
5
1
5
1
5
1
1
Series
C0805
C1206
C1210
C1812
C1825
C2225
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
100 1
Voltage DC
50
50
50
50
3
Roll Over for Order Info.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Table 2 – Chip Thickness / Packaging Quantities
Thickness Code
AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF
Chip Size
01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225
Thickness ± Range (mm)
0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.05 0.80 ± 0.07 0.80 ± 0.10 0.80 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.25 ± 0.20 0.78 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.25 ± 0.15 1.60 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.50 ± 0.20 1.55 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 1.85 ± 0.20 1.85 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 2.25 ± 0.20 2.50 ± 0.20 0.80 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.30 ± 0.10 1.40 ± 0.15 1.50 ± 0.10 1.55 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.10 ± 0.15 1.15 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.70 ± 0.15 1.80 ± 0.15 2.40 ± 0.15 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.60 ± 0.20
Qty per Reel 7" Plastic
Qty per Reel 13" Plastic
Qty per Reel 7" Paper
15000 15000 10000 4000 4000 4000 4000 4000
Qty per Reel 13" Paper
50000 10000 10000 10000 10000 10000
Qty per Bulk Cassette
50000 15000
4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000
10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000
4000
10000
Package Quantity Based on Finished Chip Thickness Specifications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: • KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
EIA Size Code
01005 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
Metric Size Code
0402 0603 1005 1608 2012 3216 3225 4520 4532 4564 5650 5664
Density Level A: Maximum (Most) Land Protrusion (mm)
C 0.33 0.38 0.50 0.90 1.00 1.60 1.60 2.30 2.15 2.15 2.75 2.70 Y 0.46 0.56 0.72 1.15 1.35 1.35 1.35 1.75 1.60 1.60 1.70 1.70 X 0.43 0.52 0.72 1.10 1.55 1.90 2.80 2.30 3.60 6.90 5.50 6.90 V1 1.60 1.80 2.20 4.00 4.40 5.60 5.65 7.40 6.90 6.90 8.20 8.10 V2 0.90 1.00 1.20 2.10 2.60 2.90 3.80 3.30 4.60 7.90 6.50 7.90 C 0.28 0.33 0.45 0.80 0.90 1.50 1.50 2.20 2.05 2.05 2.65 2.60
Density Level B: Median (Nominal) Land Protrusion (mm)
Y 0.36 0.46 0.62 0.95 1.15 1.15 1.15 1.55 1.40 1.40 1.50 1.50 X 0.33 0.42 0.62 1.00 1.45 1.80 2.70 2.20 3.50 6.80 5.40 6.80 V1 1.30 1.50 1.90 3.10 3.50 4.70 4.70 6.50 6.00 6.00 7.30 7.20 V2 0.70 0.80 1.00 1.50 2.00 2.30 3.20 2.70 4.00 7.30 5.90 7.30 C 0.23 0.28 0.40 0.60 0.75 1.40 1.40 2.10 1.95 1.95 2.55 2.50
Density Level C: Minimum (Least) Land Protrusion (mm)
Y 0.26 0.36 0.52 0.75 0.95 0.95 0.95 1.35 1.20 1.20 1.30 1.30 X 0.23 0.32 0.52 0.90 1.35 1.70 2.60 2.10 3.40 6.70 5.30 6.70 V1 1.00 1.20 1.60 2.40 2.80 4.00 4.00 5.80 5.30 5.30 6.60 6.50 V2 0.50 0.60 0.80 1.20 1.70 2.00 2.90 2.40 3.70 7.00 5.60 7.00
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Ripple Current Terminal Strength Board Flex
Reference
Heat Generation ∆T : 20ºC max. JIS-C-6429 JIS-C-6429
Test or Inspection Method
Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve. (Ripple voltage must be < rated voltage) Appendix 1, Note: Force of 1.8kg for 60 seconds. Appendix 2, Note: 2mm (min) for all except 3mm for C0G. Magnification 50X. Conditions:
Solderability
J-STD-002
a) Method B, 4 hrs @ 155°C, dry heat @ 235°C b) Method B @ 215°C category 3 c) Method D, category 3 @ 260°C
Temperature Cycling Biased Humidity Moisture Resistance Thermal Shock High Temperature Life Storage Life Mechanical Shock Resistance to Solvents
JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 MIL-STD-202 Method 108 MIL-STD-202 Method 213 MIL-STD-202 Method 215
1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity: 1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. -55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes. Air-Air. 1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied. 150°C, 0VDC, for 1000 Hours. Figure 1 of Method 213, Condition F. Add aqueous wash chemical - OKEM Clean or equivalent.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
KE
ME
T
®
Embossed Plastic* or Punched Paper Carrier.
Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
Sprocket Holes
Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape
178mm (7.00") or 330mm (13.00")
Anti-Static Cover Tape (.10mm (.004") Max Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration (mm)
EIA Case Size
01005 - 0402 0603 - 1210 1805 - 1808 ≥ 1812 KPS 1210 KPS 1812 & 2220 Array 0508 & 0612
Tape size (W)*
8 8 12 12 12 16 8
Pitch (P1)*
2 4 4 8 8 12 4
*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1004-1 • 10/12/2010 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T T2 P2 ØDo Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
Ao F Ko B1 Bo E2 W
S1 T1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity
P1 ØD 1
Embossment For cavity size, see Note 1 Table 5
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) D0 D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 0.600 (0.024) T Max. T1 Max.
1.75 ± 0.10 (0.069 ± 0.004)
4.0 ± 0.10 (0.157 ± 0.004)
2.0 ± 0.05 (0.079 ± 0.002)
0.600 (0.024)
0.100 (0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm Pitch Single (4mm) Single (4mm) & Double (8mm) Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F 3.5 ± 0.05 (0.138 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) P1 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) T2 Max 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Max 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T ØDo P2 Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
A0
F E2 W
Bottom Cover Tape
B0
T1
P1
Top Cover Tape
T1
Center Lines of Cavity
Cavity Size, See Note 1, Table 7 Bottom Cover Tape
G
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm D0 1.5 +0.10-0.0 (0.059 +0.004, -0.0) E1 1.75 ±0.10 (0.069 ±0.004) P0 4.0 ±0.10 (0.157 ±0.004) P2 2.0 ±0.05 (0.079 ±0.002) T1Max 0.10 (.004) Max. G Min 0.75 (.030) R Ref. Note 2 25 (.984)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 8mm Pitch Half (2mm) Single (4mm) E2 Min 6.25 (0.246) F 3.5 ± 0.05 (0.138 ± 0.002) 2.0 ± 0.05 (0.079 ± 0.002) 4.0 ± 0.10 (0.157 ± 0.004) P1 T Max 1.1 (0.098) W Max 8.3 (0.327) 8.3 (0.327) A0 B 0 Note 5
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Packaging Information Performance Notes
Tape Width
8mm 12mm & 16mm
1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Peel Strength
0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum Component Rotation
° T
Maximum Component Rotation Top View
Typical Pocket Centerline
Maximum Component Rotation Side View
° s
Bo
Tape Width (mm) 8,12 16-200
Maximum Rotation ( 20 10
° T)
Typical Component Centerline
Ao
Tape Width (mm) 8,12 16-56 72-200
Maximum Rotation ( 20 10 5
° S)
Figure 4 – Maximum Lateral Movement
8mm & 12mm Tape
0.5 mm maximum 0.5 mm maximum
16mm Tape
1.0 mm maximum 1.0 mm maximum
Figure 5 – Bending Radius
Embossed Carrier Punched Carrier
R
Bending Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Figure 6 – Reel Dimensions
Full Radius, See Note Access Hole at Slot Location (Ø 40 mm min.)
W3 (Includes
flange distortion at outer edge)
W2 (Measured at hub) A D
(See Note)
C
(Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth
N W1 (Measured at hub)
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern Constant Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm A 178 ± 0.20 (7.008 ± 0.008) or 330 ± 0.20 (13.000 ± 0.008) B Min 1.5 (0.059) C 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) D Min 20.2 (0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size 8mm 12mm 16mm 50 (1.969) N Min 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) W1 W2 Max 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) W3 Shall accommodate tape width without interference
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier Punched Carrier 8 mm & 12 mm only Carrier Tape Round Sprocket Holes
END
START
Top Cover Tape
Elongated Sprocket Holes (32 mm tape and wider)
Trailer 160 mm minimum,
Top Cover Tape
Components
100 mm Min. Leader 400 mm Minimum,
Figure 8 – Maximum Camber
Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
6 8 ± 0.1 8 8 ± 0.1 12.0 ± 0.1
1.5 ± 2.0 ± 3.0 ±
0.1 0 0 0.1 0.2 0
53 3* 31.5 ± 0.2 0 36 ± 0 0.2 19.0*
10*
110 ± 0.7
5 0*
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters EIA Size Metric Size L Length Code Code
0402 0603 1005 1608 1.0 ± 0.05 1.6 ± 0.07
W Width
0.5 ± 0.05 0.8 ± 0.07
B Bandwidth
0.2 to 0.4 0.2 to 0.5
S Separation minimum
0.3 0.7
T Thickness
0.5 ± .05 0.8 ± .07
Number of Pcs/Cassette
50,000 15,000
Table 10 – Capacitor Marking
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)
Numeral Alpha Character
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y
Capacitance (pF) For Various Numeral Identifiers
9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000
Example shown is 1,000 pF capacitor
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
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All product specifications, statements, information and data (collectively, the “Information”) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we specifically disclaim – any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1004-1 • 10/12/2010
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Z5U Dielectric, 50VDC-100VDC (Commercial Grade)
KEMET Corporation World Headquarters
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Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1004-1 • 10/12/2010 15